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Common footprints to use: | Common footprints to use: | ||
* | * Connector_Molex:Molex_KK-254_AE-6410-02A_1x02_P2.54mm_Vertical | ||
* | * Capacitor_THT:CP_Radial_D5.0mm_P2.50mm | ||
* | * Capacitor_THT:CP_Radial_D5.0mm_P2.00mm | ||
* | * Capacitor_THT:C_Rect_L7.0mm_W2.0mm_P5.00mm | ||
* | * Capacitor_THT:C_Rect_L11.0mm_W4.2mm_P10.00mm_MKT | ||
* | * Resistor_THT:R_Axial_DIN0207_L6.3mm_D2.5mm_P2.54mm_Vertical | ||
* Resistor_THT:R_Axial_DIN0411_L9.9mm_D3.6mm_P12.70mm_Horizontal | |||
* Package_TO_SOT_THT:TO-18-3 | |||
== PCB Layout == | == PCB Layout == |
Latest revision as of 16:51, 8 July 2025
Notes
Tutorial here
General workflow:
- Draw Schematic
- Create symbols if needed
- Assign Footprints to symbols
- Create new footprints if needed
- File → Schematic Setup… → Electrical Rules → Violation Severity
- Tools → Update PCB from Schematic…
- Design PCB
- Inspect → Design Rules Checker
- 3D View to check
Schematic Capture
Shortcut keys:
- M : Move
- R : Rotate
- G : Drag
- P : Add power
- L : Add net label (wires with same label are implicitly connected)
Options:
- Use PWR_FLAG if necessary.
- Use netclasses to define specific design rules for different connections (eg widths for Pwr or Data).
Common footprints to use:
- Connector_Molex:Molex_KK-254_AE-6410-02A_1x02_P2.54mm_Vertical
- Capacitor_THT:CP_Radial_D5.0mm_P2.50mm
- Capacitor_THT:CP_Radial_D5.0mm_P2.00mm
- Capacitor_THT:C_Rect_L7.0mm_W2.0mm_P5.00mm
- Capacitor_THT:C_Rect_L11.0mm_W4.2mm_P10.00mm_MKT
- Resistor_THT:R_Axial_DIN0207_L6.3mm_D2.5mm_P2.54mm_Vertical
- Resistor_THT:R_Axial_DIN0411_L9.9mm_D3.6mm_P12.70mm_Horizontal
- Package_TO_SOT_THT:TO-18-3
PCB Layout
Shortcut keys:
- M : Move
- R : Rotate
- F : Flip to other side of board
- V : Add a via
- SHIFT-SPACE : toggle to 45 deg mode
Layers:
- Edge.Cuts : Outline of board and cutouts
- F.Cu / B.Cu : Copper traces
- F.Silkscreen / B.Silkscreen : Component outlines and text
- F.Mask / B.Mask : Solder mask
- F.Fab / B.Fab : Fabrication notes, including an outline of components
- F.Paste / B.Paste : Solder paste for SMD components
- F.Adhesive / B.Adhesive : Glue for SMT components
Design of a new footprint:
- Exact part outline drawn on the F.Fab layer
- A slightly larger outline on the F.Silkscreen layer
- A courtyard on the F.Courtyard layer surrounding the entire footprint to prevent overlaps with other footprints.
When adding text to a silkscreen, variable subsitution is available, eg:
- ${TITLE}
- ${REVISION}
Add fill zones for groundplanes, etc, bases on net labels:
- "Add a filled zone" button -> define a closed shape
- Edit → Fill All Zones"
- These have to be manually updated when components are moved
Export
- Export Gerber files
- Export drill file
- Zip up the exported files and send to fabrication house.