Jump to content

KiCad: Difference between revisions

From Smithnet Wiki
 
(2 intermediate revisions by the same user not shown)
Line 28: Line 28:


Common footprints to use:
Common footprints to use:
* ?
* Connector_Molex:Molex_KK-254_AE-6410-02A_1x02_P2.54mm_Vertical
* ?
* Capacitor_THT:CP_Radial_D5.0mm_P2.50mm
* ?
* Capacitor_THT:CP_Radial_D5.0mm_P2.00mm
* ?
* Capacitor_THT:C_Rect_L7.0mm_W2.0mm_P5.00mm
* ?
* Capacitor_THT:C_Rect_L11.0mm_W4.2mm_P10.00mm_MKT
* ?
* Resistor_THT:R_Axial_DIN0207_L6.3mm_D2.5mm_P2.54mm_Vertical
* Resistor_THT:R_Axial_DIN0411_L9.9mm_D3.6mm_P12.70mm_Horizontal
* Package_TO_SOT_THT:TO-18-3


== PCB Layout ==
== PCB Layout ==
Line 40: Line 42:
* M : Move
* M : Move
* R : Rotate
* R : Rotate
* F : Flip to other side of board
* V : Add a via
* SHIFT-SPACE : toggle to 45 deg mode
* SHIFT-SPACE : toggle to 45 deg mode


Layers:
Layers:
* Edge.Cuts : Outline of board
* Edge.Cuts : Outline of board and cutouts
* F.Cu / B.Cu : Copper traces
* F.Cu / B.Cu : Copper traces
* F.Silkscreen / B.Silkscreen
* F.Silkscreen / B.Silkscreen : Component outlines and text
* F.Mask / B.Mask
* F.Mask / B.Mask : Solder mask
* F.Fab / B.Fab : Fabrication notes, including an outline of components
* F.Paste / B.Paste : Solder paste for SMD components
* F.Adhesive / B.Adhesive : Glue for SMT components


Design of a new footprint:
Design of a new footprint:
Line 57: Line 64:
* ${REVISION}
* ${REVISION}


Add fill zones for groundplanes, etc, bases on net labels.
Add fill zones for groundplanes, etc, bases on net labels:
* "Add a filled zone" button -> define a closed shape
* Edit → Fill All Zones"
* These have to be manually updated when components are moved


== Export ==
== Export ==

Latest revision as of 16:51, 8 July 2025

Notes

Tutorial here

General workflow:

  • Draw Schematic
    • Create symbols if needed
  • Assign Footprints to symbols
    • Create new footprints if needed
  • File → Schematic Setup…​ → Electrical Rules → Violation Severity
  • Tools → Update PCB from Schematic…​
  • Design PCB
  • Inspect → Design Rules Checker
  • 3D View to check

Schematic Capture

Shortcut keys:

  • M : Move
  • R : Rotate
  • G : Drag
  • P : Add power
  • L : Add net label (wires with same label are implicitly connected)

Options:

  • Use PWR_FLAG if necessary.
  • Use netclasses to define specific design rules for different connections (eg widths for Pwr or Data).

Common footprints to use:

  • Connector_Molex:Molex_KK-254_AE-6410-02A_1x02_P2.54mm_Vertical
  • Capacitor_THT:CP_Radial_D5.0mm_P2.50mm
  • Capacitor_THT:CP_Radial_D5.0mm_P2.00mm
  • Capacitor_THT:C_Rect_L7.0mm_W2.0mm_P5.00mm
  • Capacitor_THT:C_Rect_L11.0mm_W4.2mm_P10.00mm_MKT
  • Resistor_THT:R_Axial_DIN0207_L6.3mm_D2.5mm_P2.54mm_Vertical
  • Resistor_THT:R_Axial_DIN0411_L9.9mm_D3.6mm_P12.70mm_Horizontal
  • Package_TO_SOT_THT:TO-18-3

PCB Layout

Shortcut keys:

  • M : Move
  • R : Rotate
  • F : Flip to other side of board
  • V : Add a via
  • SHIFT-SPACE : toggle to 45 deg mode

Layers:

  • Edge.Cuts : Outline of board and cutouts
  • F.Cu / B.Cu : Copper traces
  • F.Silkscreen / B.Silkscreen : Component outlines and text
  • F.Mask / B.Mask : Solder mask
  • F.Fab / B.Fab : Fabrication notes, including an outline of components
  • F.Paste / B.Paste : Solder paste for SMD components
  • F.Adhesive / B.Adhesive : Glue for SMT components

Design of a new footprint:

  • Exact part outline drawn on the F.Fab layer
  • A slightly larger outline on the F.Silkscreen layer
  • A courtyard on the F.Courtyard layer surrounding the entire footprint to prevent overlaps with other footprints.

When adding text to a silkscreen, variable subsitution is available, eg:

  • ${TITLE}
  • ${REVISION}

Add fill zones for groundplanes, etc, bases on net labels:

  • "Add a filled zone" button -> define a closed shape
  • Edit → Fill All Zones"
  • These have to be manually updated when components are moved

Export

  • Export Gerber files
  • Export drill file
  • Zip up the exported files and send to fabrication house.